展会基本信息
- 中 文 名
- Bondexpo Stuttgart (International Trade Fair for Adhesive Bonding and Sealing Technology)
- 举办城市
- Stuttgart
- 举办地点
- Messepiazza 1, 70629 Stuttgart, Stuttgart Germany
- 简 称
- Bondexpo
- 举办时间
- 观众数量
- 38421人
- 展商数量
- 895家
展会简介
Bondexpo Stuttgart is the world's leading meeting place for industry professionals. Since its inception in 2007, it has become a global hub for the industry and its users. The exhibition covers the entire process chain from bonding, potting, sealing, and foam assembly to joining, providing solutions for practical applications and future industry challenges. Bondexpo showcases new future pathways in adhesives, insulation, foaming, sealing, and encapsulation. Precision bonding, potting, sealing, a




