Integrated Circuit Design and IP Cores:Design of general-purpose and application-specific chips, AI chips, power management chips, sensor chips, RF chips, MCU/MPU master control chips, IP core licensing, EDA design software, and customized chip solution services, among others.

Wafer Fabrication and Foundry Services:Foundry services, advanced process technologies, semiconductor substrates, epitaxial wafers, photolithography, etching, thin-film deposition, and other manufacturing processes tailored to meet the mass-production requirements of mid-to-high-end chips.

Packaging and Testing Technologies and Products:Traditional packaging, advanced packaging (such as Chiplet, SiP, and 2.5D/3D packaging), chip testing equipment, reliability assessment, sorting equipment, packaging materials, and related supporting products and technologies.

Semiconductor Equipment and Core Materials:Semiconductor-specific equipment, including lithography tools, etchers, thin-film deposition systems, cleaning equipment, and inspection devices; as well as core consumables and materials such as photoresists, specialty gases, target materials, polishing slurries, and packaging substrates.

Chip-Based End-Application Solutions:Integrated chip application solutions for industrial control, smart manufacturing, new-energy vehicles, photovoltaic and wind energy, artificial intelligence, the Internet of Things, low-altitude platforms, consumer electronics, security, and communications—enabling deep integration between chips and end-use scenarios.