行业报告︱半导体制造光刻机发展分析

摘要：分析了半导体产业国际国内市场状况，研究了光刻机国际国内市场状况、竞争企业状况；同时从生产线应用配置、细分技术、行业应用、竞争因素、主要技术与供应链、技术发展趋势等角度对光刻机产业发展状况进行了深入分析，并对国内光刻机的发展进行思考。

关键词：半导体制造；光刻机；市场状况；产业状况；发展趋势

Analysis on the Development of Lithography Equipment for SemiconductorLIU Bin(The 45th Research Institute of CETC, Beijing 100176, China) Abstract：The international and domestic market status of the semiconductor industry been analyzing in this paper, the international and domestic market status of lithography equipment, and the competitive enterprise situation are studied. Furthermore，the development status of the lithography equipment industry are analyzed deeply from the perspectives of production line application configuration, segmenting technology, industry application, competitive factors, main technology and supply chain, and technological development trends, and also considered about the domestic development of lithography equipment. Keywords：Semiconductor manufacturing; Lithography equipment; Market status; Industrial status; Development trends 半导体产业是现代信息社会发展的基础，是经济增长和技术创新的核心要素。当前全球半导体产业正在经历一个技术进步和创新浪潮的发展时期，特别是占据半导体产业规模超过80%的集成电路，在电子信息、社会生活、航空航天等领域被广泛应用。集成电路在计算能力提升、功耗降低、上市周期加快、成本降低等方面不断进步的需求给芯片产业的发展带来全新的挑战。芯片制造工艺的先进性直接决定了芯片的性能优劣、电源效率和体积。目前半导体行业仍以28 nm工艺为分水岭，分为先进工艺和成熟工艺，先进工艺主要用于对芯片计算性能要求更高的领域，成熟工艺主要用于对制造成本要求较低的场景。先进的制造工艺代表了行业能力的硬实力，目前台积电、三星进入5 nm工艺量产，3 nm工艺开始风险投产。由于国际产业环境的限制，目前国内半导体工艺水平达到28 nm，存在一定的技术差距。